Showing posts with label processor. Show all posts
Showing posts with label processor. Show all posts

Saturday, 13 September 2014

Basics: Why Active low signals used?

Are you working on digital circuits? Then you must be using control signals in your design and must be hearing about terminologies like ACTIVE LOW, ACTIVE HIGH. We sometimes just follow the design recommendations and never think of the need to do it. Let us analyse the need for Active Low in our designs.

What is active low?
A general criteria while using any control signals (like Enable) is to make it HIGH from LOW state. But in some cases, like the chip select and reset it is in reverse, the signal will be initially HIGH and when it is turned LOW, it means that particular signal is asserted (when asserted, it changes the connected chip functionality as desired, can say connected chip changes state). Control signals which are used in this manner are termed Active Low. The terminology itself tells that signal is termed active when it is LOW.

How is Active LOW signal differentiated from Active HIGH signal?
The representation of the signal (as per the Active HIGH or Active LOW ) in the datasheet of that particular chip is different. Active LOW is represented by having a dash on top of the signal name. Chip Select if active low is represented as (CS).

Reasons for using Active LOW only:
  • Let us assume that you want to choose a device between n-channel MOSFET and p-channel MOSFET for your application. One would always prefer going for n-channel as electrons are the majority carriers in this type of device and have the highest mobility then holes. In this case, when the transistor is ON, the output is driven low. So, a normal condition is that output is high and when transistor in on output is low. This is one of the factor which makes implementation of active low state easy. Same mobility case applies to BJT also where NPN is preferred compared to PNP.
  • Active LOW always helps eliminate indeterminate states due to improper supply voltages. 
  • A genuine reason is that it is easier to pull down a signal than pulling it up. 
  • Under a Active low condition, it is always easy to use wired-or condition and apply common reset to several chips. So, fanout can be increased. Control signal count can be reduced.
  • For critical signals like Reset, it is always important that a state is maintained properly, if they are made active high, any noisy transitions may cause improper reset in the circuit. So, a state of high initially and then making it low to reset the chip can be the best option. 
  • Consider the sourcing capability for example of a micro controller which doesn't go beyond 10 mA. If you want to source more you may have to use an external driver. In these cases, it is always preferable that we use Active LOW. For digital circuits, sink current capability is more than source current.

Saturday, 14 June 2014

Thermal paste/compound - A small note

Thermal paste is a heat sink compound used on top of the processors (whether it be graphical or central processor), regulators for heat to follow smoothly to external medium. The mechanical designers suggest using a heat sink based on the thermal calculations. The principal behind using a heat sink in that the operating temperature of the device should not exceed the maximum specified ratings in the datasheet.

Operating temperature of a specific heat generating device is calculated by summation of junction temeparature and heat generated (Heat generated is the product of thermal resistance and power of operation). When this sum exceeds operating temperature specification that effect is catstrophic and can lead to device failure.

So, we have to use heat sink on top to enable the heat to escape from the device. Keep in mind that thermal paste is filling the imprefections of heat sink. The heat sink will be mounted on top of the device. Even though the heat sink is placed on top of device touching it there will be a air gap in between. Air is always a poor conductor of heat in which case another media must enable smooth heat flow. For this purpose we use a thermal paste. Thermal paste is a highly heat conductive paste.You mave have a large heat sink with exception fin structure for smooth heat flow, but, without a thermal paste the entire cost you have put on heat sink is a mere waste.

The thermal paste applied on top can be of different types. These can be electrically conductive as well as non-conductive. In a electronic board, it is always prefferable to use a non-conductive type. Cermaic based paste is one type of thermal paste. Arctic silver is the most preffered thermal paste.

What is Integrated Heat Spreader?
Keep in mind that the modern processors have a metal kind of enclosure for heat flow assistance. This we call a integrated heat spreader (IHS).

I already have a heat sink compound on the device. How do i clean it?
Usin Isopropyl Alcohol. Use a isopropyl dipped smooth cloth to rub off the paste.